The hardware reference manual for Rev. B4 is now available. Please see BeagleBoard.org - hardware for the link.
Hello
Aplogies if this is not the best place to post this, but I am working
as part of a team who are going to utilise the OMAP3530 chip for a new
product line.
Although we are sure the device will do the job we want, we are
growing a little more concerned about the complexities of laying the
board out, and the capabilities of the manufacture of the board to do
what we need.
Does anyone have experience of board manufactures for this sort of
thing, and any advice on the complexities of the layout. The key
concern is about the via's and the extra costs involved in using laser
drilled via's
We are all newbies at this 'generation' of chip design so please, any
help will be gratefully received.
Thanks in advance
Richard
rjnbarrass@gmail.com wrote:
Does anyone have experience of board manufactures for this sort of
thing, and any advice on the complexities of the layout. The key
concern is about the via's and the extra costs involved in using laser
drilled via's
I've worked with Cogent Computer Systems. They have an OMAP35xx board underway
now, and I have developed (successfully) boards of similar complexity with them
before.
Cogent's approach is to put the complicated chips onto a system-on-module (SOM)
board, which features an SODIMM connector. You put the mating connector onto a
breakout board (they have some generic designs, or you design one, or they do
one on your behalf), which is of much lower complexity and therefore much easier
to get right. The hard stuff stays on the SOM, where it's completely Cogent's
problem.
Your concerns are well-founded. If you go it alone, expect your first attempt
to not go well. That's kind of how I ended up at Cogent. 
I don't work for Cogent, I'm just a happy customer. This stuff isn't easy, and
my sense is there aren't a lot of outfits that can deliver consistently. Cogent
seems to have figured it out, which based on my observations means more than
just getting the design rules right--- there's a whole vendor chain that has to
be involved. I'd rather focus on other stuff.
Contact: Michael Kelly <mike@cogcomp.com>
Good luck!
b.g.
Take a look on the TI OMAP website under Application Notes. There are three different packages available for the OMAP3530 and there are guidelines for each package. The BeagleBoard uses the .4mm pitch package. In addition the Allegro database and gerber files for the BeagleBoard are available for download on beagleboard.org.
http://focus.ti.com/docs/prod/folders/print/omap3530.html
The key to the .4mm pitch from a manufacturing standpoint is the PCB soldermask. If it is not correct, then you will have issues. From a cost standpoint via in pad and blind/buried vias will drive your PCB costs up. The .5mm and .65mm may be better options depending on your application. The .5mm has not as of yet been published on the website.
There are other modules suppliers that will be coming online in the next few months that may also be options for you.
Gerald