Dear Beagleboard friends,
I am an avid fan of beagleboard, don't have a board yet, but intend to
make one myself.
Have been looking at the schematics and the complexities of the board
and its manufacturing process. The crux of the problem is the pcb
manufacturing process and also the soldering process is very critical.
I have been pondering over the idea of redesigning the Beagleboard
where these are the main points for considering re-design.
1. The board should be 2-4 layer design, even if it increases the
size. In India we have manufacturing process up to 4 layer design, 6
layer seems currently next to impossible.
2. Put DDR2/DDR3/SDRAM memory chipset we use in the computers instead
of the POP Package, this will reduce the soldering re-flow
complexity. DDR would be appropriate as now a days SDRAM chip are not
3. Keep the I2C, I2S, SPI, JTAG, Stereo I/O, RS232, USB 2.0 OTG, S-
video and Alternate power remove DVI, most cases S-Video or standard
VGA adapter would work in developing countries.
4. Introduce SATA HDD capabilities, along with the already available
SD/MMC interface using SPI.
5. Reducing the cost, try to put non-SMD component to SMD wherever
possible, soldering would be easier.
Keeping the cost low, is like the TATA Nano, $2000 small wonder car
want to bring the same effect to Beagleboard initiative.
Gerard, need your opinion and support to make this.
Beagleboard friends your thoughts on this one.