When my BeagleBoard B4 is sitting at the boot monitor the CPU module
is hardly warm at all, but when I run the Ångström demo it gets hot.
I don't have a good way to measure its actual temperature, but it's
uncomfortable to leave my finger there more than 4 seconds or so. Now
I'm actually feeling the back of the Micron DDR/NAND module, so maybe
it's what's getting hot refreshing all those pretty graphics.
However, since they're stacked so tightly I figure if one is getting
hot, so are the others.
The DVI driver chip gets quite warm as well, even slightly hotter than
the CPU module. The S-video connector gets warm too, so it must be
conducting heat from the ground plane. BGA packages conduct a lot of
heat through those tiny solder balls.
I do run with the board open to the air. I don't think an enclosed
box is a good idea.
Would it be advisable to add a small stick-on heat sink? As a
hardware engineer, I always like things to run cool so they don't fail
in the field like the XBox a couple of years ago and more recently